POSTED BY: YU-TZU CHIU / DI, MAI 03, 2011
A Taiwanese R&D center says it has come up with a packaging technology that will speed development of multi-chip systems.
Taiwan's National Chip Implementation Center (CIC) calls the technology MorPACK, for morphing package. MorPACK is three-dimensional (3D) embedded system integration platform that can integrate several different kinds of chips. CIC says the technology will cut down development time and cost, because it allows for the easy integration of chips with different functions into one tightly-bound package.